LiPOLY’s TPS series is a two-part compound sealing glue that can be cured at room temperature or high temperature. The sealing glue is a liquid fluid thermally conductive adhesive that can fill the gaps in the air space around electronic devices. After curing, it will interact with heating electronic components and radiators, so that electronic products can run at high power for heat conduction. It’s a nice gap filler material with thermal conductivity 0.8~2.0W/m*K.